Guest Editorial Special Section on Ultrawide/Wide Bandgap Device, Packaging, Control, EMI, and Applications for Power Electronics

被引：0

作者：

Mazumder, Sudip K. ^{[1
]}

Shen, Zheng John ^{[2
]}

Wang, Shuo ^{[3
]}

机构：

[1] Univ Illinois, Chicago, IL 60607 USA

[2] Simon Fraser Univ, Burnaby, BC V5A 1S6, Canada

[3] Univ Florida, Dept Elect & Comp Engn, Gainesville, FL 32611 USA

来源：

IEEE TRANSACTIONS ON POWER ELECTRONICS | 2024年 / 39卷 / 12期

关键词：

Special issues and sections; Wide band gap semiconductors; Semiconductor device packaging; Electromagnetic interference; Power electronics; Control systems; Photonic band gap; Semiconductor device measurement;

D O I：

10.1109/TPEL.2024.3468488

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

引用

页码：15693 / 15695

页数：3

共 38 条

[1] Guest Editorial Special Section on Ultrawide/Wide Bandgap Device, Packaging, Control, EMI, and Applications for Power Electronics
Mazumder, Sudip K.
Shen, John
Wang, Shuo
IEEE TRANSACTIONS ON POWER ELECTRONICS, 2024, 39 (10) : 12542 - 12544
[2] Special Section on Ultrawide/Wide Bandgap Device, Packaging, Control, EMI, and Applications for Power Electronics
Mazumder, Sudip K.
Shen, Zheng John
Wang, Shuo
IEEE TRANSACTIONS ON POWER ELECTRONICS, 2024, 39 (11) : 14304 - 14306
[3] Guest Editorial Special Section Advances in Research and Applications of Power Electronics in T&D Systems
Gomis-Bellmunt, Oriol
IEEE TRANSACTIONS ON POWER DELIVERY, 2024, 39 (01) : 339 - 340
[4] Guest Editorial Special Section on Advanced Medium-Voltage Power Electronics for Grid Interactive Applications
Chung, Henry Shu-Hung
Chen, Wu
Xue, Yaosuo
IEEE TRANSACTIONS ON POWER ELECTRONICS, 2024, 39 (12) : 15479 - 15480
[5] Guest Editorial Special Section on Advanced Medium-Voltage Power Electronics for Grid Interactive Applications
Chung, Henry Shu-Hung
Chen, Wu
Xue, Yaosuo
IEEE TRANSACTIONS ON POWER ELECTRONICS, 2024, 39 (11) : 14179 - 14180
[6] Guest Editorial Special Section on Advanced Medium-Voltage Power Electronics for Grid Interactive Applications
Chung, Henry Shu-Hung
Chen, Wu
Xue, Yaosuo
IEEE TRANSACTIONS ON POWER ELECTRONICS, 2024, 39 (10) : 12183 - 12184
[7] An Overview of Wide Bandgap Power Semiconductor Device Packaging Techniques for EMI Reduction
Zhang, Boyi
Wang, Shuo
2018 IEEE SYMPOSIUM ON ELECTROMAGNETIC COMPATIBILITY, SIGNAL INTEGRITY AND POWER INTEGRITY (EMC, SI & PI), 2018, : 297 - 302
[8] Guest Editorial of the Special Section on Generative Artificial Intelligence With Applications on Consumer Electronics
Zhao, Mingbo
Meng, Weizhi
Liu, Bingyi
Yang, Yimin
IEEE TRANSACTIONS ON CONSUMER ELECTRONICS, 2024, 70 (02) : 4955 - 4957
[9] Guest Editorial Special Section on Advancing Power Electronics Reliability: Components, Systems, and Intelligent Operation
Wang, Huai
Hu, Jingxin
De Doncker, Rik W.
IEEE TRANSACTIONS ON POWER ELECTRONICS, 2024, 39 (12) : 15565 - 15566
[10] Guest Editorial Special Section on Advancing Power Electronics Reliability: Components, Systems, and Intelligent Operation
Wang, Huai
Hu, Jingxin
de Doncker, Rik W.
IEEE TRANSACTIONS ON POWER ELECTRONICS, 2024, 39 (11) : 14216 - 14217

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