High-speed formation of pure copper layers via multibeam laser metal deposition with blue lasers

被引:0
|
作者
Takenaka, Keisuke [1 ]
Yoshida, Tamaki [2 ]
Yamashita, Yorihiro [3 ]
Sato, Yuji [1 ]
Tsukamoto, Masahiro [1 ]
机构
[1] Osaka Univ, Joining & Welding Res Inst, 11-1 Mihogaoka, Ibaraki, Osaka 5670047, Japan
[2] Osaka Univ, Grad Sch Engn, 1-1 Yamadaoka, Suita, Osaka 5650871, Japan
[3] Univ Fukui, Fac Engn, 3-9-1 Bunkyo, Fukui, Japan
关键词
blue diode laser; multi-beam laser deposition; pure copper;
D O I
10.2351/7.0001649
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
To realize a carbon-neutral society, it is necessary to shift from gasoline-powered vehicles to electric vehicles. Electric vehicles use copper components such as coil motors and batteries for which copper joining technology is important. Additive manufacturing is one of the most essential technologies for the next generation of manufacturing. Therefore, the technology for forming pure copper layer on a pure copper substrate is important. Laser metal deposition (LMD) is one of the additive manufacturing technologies. A blue diode laser is expected to be effective in shaping pure copper parts because light absorptance of pure copper at blue light is higher than that of near-infrared light. Thus, a multibeam LMD system with the blue diode laser in which metal powder was supplied perpendicular to the processing point and multiple lasers were irradiated from the surroundings was developed for additively manufactured pure copper. In our previous study, we succeeded in forming a pure copper layer on a pure copper substrate at a speed of 1.5 mm/s with blue diode lasers. However, an increase in processing speed was necessary for industrial application. It is considered that the improvement of energy density at the processing point and the control of heat input to the powder and the substrate by lasers are essential to improve the processing speed. Therefore, in this study, we designed an optical system with ten times higher energy density and calculated the heat input to the powder to form a pure copper layer at a speed of 10 mm/s or faster.
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页数:7
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