Effect of Etching Gas on Adhesion between Mold Resin and Sputtered Stainless Steel Ground Films in Electromagnetic Shield Packages

被引：0

作者：

Homma, Soichi ^{[1
,4
]}

Okada, Daichi ^{[2
]}

Sawanobori, Akihito ^{[1
]}

Yamamoto, Susumu ^{[1
]}

Imoto, Takashi ^{[3
]}

Nishikawa, Hiroshi ^{[5
]}

机构：

[1] Kioxia Corporation, Memory Packaging Development Department, 800 Yamanoisshiki-cho, Yokkaichi, Mie,512-8550, Japan

[2] Kioxia Corporation, Memory Packaging Engineering Department, 800 Yamanoisshiki-cho, Yokkaichi, Mie,512-8550, Japan

[3] Kioxia Corporation, Memory Packaging Development Department, 2-5-1 Kasama, Sakae-ku, Kanagawa, Yokohama,247-8585, Japan

[4] Osaka University, Graduate School of Engineering, 2-1 Yamadaoka, Osaka, Suita,565-0871, Japan

[5] Osaka University, Joining and Welding Research Institute, 11-1 Mihogaoka, Osaka, Ibaraki,567-0047, Japan

来源：

2023 International Conference on Electronics Packaging, ICEP 2023 | 2023年

关键词：

D O I：

暂无

中图分类号：

学科分类号：

摘要：

Adhesion - Brazing - Copper - Electromagnetic pulse - Electromagnetic shielding - Electronics packaging - Etching - Fillers - Integrated circuit interconnects - Molds - Silica - Silicon - Silicon alloys - Silicon oxides - Stability criteria - Stainless steel

引用

页码：113 / 114