Temperature Effects in Packaged RF MEMS Switches with Optimized Gold Electroplating Process

被引：0
|
作者：
Wang, Lifeng [1 ]
Jiang, Lili [1 ,2 ]
Ma, Ning [1 ]
Huang, Xiaodong [1 ]
机构：
[1] Southeast Univ, Key Lab MEMS, Minist Educ, Sch Elect Sci & Engn, Nanjing 210096, Peoples R China
[2] Nanjing Elect Devices Inst, Nanjing 210016, Peoples R China
来源：
MICROMACHINES | 2024年 / 15卷 / 09期
基金：
国家重点研发计划; 中国国家自然科学基金;
关键词：
RF MEMS switch; gold electroplating process; temperature effects; pull-in voltage; lifetime; ACTUATION VOLTAGE; LIFETIME;
D O I：
10.3390/mi15091085
中图分类号：
O65 [分析化学];
学科分类号：
070302 ; 081704 ;
摘要：
Due to its excellent electrical performance, mechanical reliability, and thermal stability, electroplated gold is still the most commonly used material for movable beams in RF MEMS switches. This paper investigates the influence of process conditions on the quality and growth rate of gold electroplating, and the optimized process parameters for the gold electroplating process are obtained. The characterization of the optimized electroplated gold layer shows that it has small surface roughness and excellent thermal stability. With this optimized gold electroplating process, the RF MEMS switches are fabricated and hermetic packaged. In order to obtain the temperature environment adaptability of the packaged switch, the influence of working temperature is studied. The temperature effects on mechanical performance (includes pull-in voltage and lifetime) and RF performance (includes insertion loss and isolation) are revealed.
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页数：13
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