High-Resolution CMOS Tactile-Proximity Sensor Array: Design, Fabrication, and Performance Evaluation

被引:0
|
作者
Wang, Yu-Chiao [1 ,2 ]
Lu, Michael S. -C. [1 ,2 ]
机构
[1] Natl Tsing Hua Univ, Dept Elect Engn, Hsinchu 300044, Taiwan
[2] Natl Tsing Hua Univ, Inst Elect Engn, Hsinchu 300044, Taiwan
关键词
Sensors; Tactile sensors; Metals; Etching; Sensor arrays; Electrodes; Silicon; Capacitive sensors; complementary metal-oxide-semiconductor (CMOS); piezoresistive sensors; INTERFACE;
D O I
10.1109/JSEN.2024.3424440
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Integrated circuit technologies provide an ideal platform for multisensor integration by leveraging well-established electronic processes. However, the integration of a large tactile sensor array with proximity sensing has not been extensively studied. In this article, we investigate the sensing capabilities of a 32 x 32 piezoresistive tactile sensor array with capacitive proximity sensing implemented using a complementary metal-oxide-semiconductor (CMOS) process. Capacitive electrodes, separated by 175 mu m, are conveniently implemented on top of the tactile pixels, each measuring 140 x 140 m(2), using metallization layers. The sensing structures were fabricated using a wet metal etch, followed by an anisotropic silicon etch. In our experiments, the tactile sensors exhibited an average sensitivity of -0.084%/kPa with a resolution of 58 Pa. The proximity sensing displayed a detection range of approximately 0.9 mm, with a resolution better than 1 mu m. These results demonstrate the significant potential of CMOS tactile-proximity sensors for applications requiring sensitive detection.
引用
收藏
页码:25468 / 25475
页数:8
相关论文
共 50 条
  • [41] High performance CMOS programmable logic array design
    Kuo, KC
    Carlson, BS
    PROCEEDINGS OF THE 44TH IEEE 2001 MIDWEST SYMPOSIUM ON CIRCUITS AND SYSTEMS, VOLS 1 AND 2, 2001, : 568 - 571
  • [42] High-resolution displacement sensor using SQUID array amplifier
    Chui, T
    Penanen, K
    Barmatz, M
    NUCLEAR PHYSICS B-PROCEEDINGS SUPPLEMENTS, 2004, 134 : 214 - 216
  • [43] HIGH-RESOLUTION CROSS-SENSOR BEAMFORMING FOR A BILLBOARD ARRAY
    BUCKER, HP
    JOURNAL OF THE ACOUSTICAL SOCIETY OF AMERICA, 1979, 65 (01): : 145 - 147
  • [44] Printed temperature sensor array for high-resolution thermal mapping
    Buecher, Tim
    Huber, Robert
    Eschenbaum, Carsten
    Mertens, Adrian
    Lemmer, Uli
    Amrouch, Hussam
    SCIENTIFIC REPORTS, 2022, 12 (01)
  • [45] Design and Evaluation of a Fast, High-Resolution Sensor Evaluation Platform Applied to MEMS Position Sensing
    Faller, Lisa-Marie
    Mitterer, Tobias
    Leitzke, Juliana Padilha
    Zangl, Hubert
    IEEE TRANSACTIONS ON INSTRUMENTATION AND MEASUREMENT, 2018, 67 (05) : 1014 - 1027
  • [46] A Low-Cost Super-Resolution Tactile Sensor: Design, Fabrication, and Validation
    Lu, Zhou
    Su, Yuan
    Ye, Qi
    Wang, Ze
    Shi, Xiufang
    Li, Gaofeng
    Chen, Jiming
    IEEE SENSORS JOURNAL, 2024, 24 (22) : 36518 - 36529
  • [47] Study of a High-Resolution and Low-Power CMOS Temperature Sensor
    Hacine, Souha
    Mailly, Frederick
    Latorre, Laurent
    Nouet, Pascal
    2012 IEEE 10TH INTERNATIONAL NEW CIRCUITS AND SYSTEMS CONFERENCE (NEWCAS), 2012, : 205 - 208
  • [48] High-resolution CMOS particle detectors: design and test issues
    Passeri, D
    Placidi, P
    Verducci, L
    Ciampolini, P
    Matrella, G
    Marras, A
    Bilei, GM
    2003 IEEE NUCLEAR SCIENCE SYMPOSIUM, CONFERENCE RECORD, VOLS 1-5, 2004, : 331 - 334
  • [49] High-resolution gravure printed lines: Proximity effects and design rules
    Grau, Gerd
    Scheideler, William J.
    Subramanian, Vivek
    PRINTED MEMORY AND CIRCUITS, 2015, 9569
  • [50] Design and fabrication of a flexible three-axial tactile sensor array based on polyimide micromachining
    Hyun-Jun Kwon
    Woo-Chang Choi
    Microsystem Technologies, 2010, 16 : 2029 - 2035