Formation of Specially Shaped Plating Film by Nickel-Copper Alloy Electrodeposition

被引：0
|
作者：
Kobayashi, T. [1 ]
Kubo, A. [1 ]
Shohji, I. [1 ]
机构：
[1] Gunma University, School of Science and Technology, 1-5-1 Tenjin-cho, Kiryu,376-8515, Japan
来源：
2022 International Conference on Electronics Packaging, ICEP 2022 | 2022年
关键词：
Compendex;
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学科分类号：
摘要：
Nickel alloys
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页码：215 / 216
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