Interlayer-free laser coating of AISI H11 tool steel for H11/Cu composite material

被引:0
作者
Vetter, Johannes [1 ,2 ]
Hentschel, Oliver [1 ,2 ]
Chechik, Lova [1 ,2 ]
Schmidt, Michael [1 ,2 ]
机构
[1] Friedrich Alexander Univ Erlangen Nurnberg, Inst Photon Technol LPT, Konrad Zuse Str 3-5, D-91052 Erlangen, Germany
[2] Erlangen Grad Sch Adv Opt Technol SAOT, Paul Gordan Str 6, D-91052 Erlangen, Germany
关键词
laser-based directed energy deposition; laser coating; porous substrate; copper infiltration; H11/Cu composite material; MICROSTRUCTURE; COPPER;
D O I
10.2351/7.0001533
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
Copper-based materials in combination with steels are of great interest for various applications in industry, such as tool manufacture, due to their high thermal conductivity. Additive manufacturing (AM) is beneficial for both tailored part geometry and customized material design. With laser-based AM, the copper-steel interface is highly prone to cracking. This study investigates a strategy of laser coating AISI H11 tool steel for a composite material consisting of AISI H11 tool steel and copper (H11/Cu) without using Ni-based interlayers. As an austenite stabilizing element, Ni dilution in H11 could lead to soft retained austenite, impeding wear resistance. The approach in this work employed presintering of tool steel powder to generate a porous H11 preform. Laser-based directed energy deposition (DED-LB/M) was used for coating H11 tool steel on the porous H11 preform followed by copper infiltration of the preform. The investigation of the effects of the main processing parameters: laser power, feed rate, and powder mass flow on the weld track geometry, clearly revealed different mechanisms when coating the porous preform compared to the conventional substrate. Defects at the coating/substrate interface such as cold crack formation were successfully avoided by adjusting the process parameters and process sequence. The developed processing strategy may in the future combine material extrusion of metals (MEX/M) and DED-LB/M to allow for intricate preform geometries and to generate H11 coatings on H11/Cu, respectively.
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页数:10
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