Experimental study on toughening UV pre-curing adhesives for electrically conductive applications

被引:0
|
作者
Correia, D.S. [1 ]
de Sousa, R.J.F. [1 ]
Gomes, P.N. [1 ]
Carbas, R.J.C. [1 ]
Marques, E.A.S. [2 ]
da Silva, L.F.M. [2 ]
机构
[1] Institute of Science and Innovation in Mechanical and Industrial Engineering (INEGI), University of Porto, Rua Dr. Roberto Frias 400, Porto,4200-465, Portugal
[2] Department of Mechanical Engineering, Faculty of Engineering (FEUP), University of Porto, Rua Dr. Roberto Frias 400, Porto,4200-465, Portugal
关键词
Adhesives - Conductive materials - Curing - Ductile fracture - Electric discharges - Fillers - Fracture toughness - Tensile testing;
D O I
暂无
中图分类号
学科分类号
摘要
引用
收藏
相关论文
共 50 条
  • [31] High Temperature Performance of Low Stress Electrically Conductive Adhesives in Electronic Applications
    Dreezen, G.
    Theunissen, L.
    Luyckx, G.
    Dooling, P.
    Borak, A.
    2008 IEEE CONFERENCE ON POLYMERS AND ADHESIVES IN MICROELECTRONICS AND PHOTONICS AND 2008 IEEE INTERDISCIPLINARY CONFERENCE ON PORTABLE INFORMATION DEVICES, 2008, : 126 - +
  • [32] Development of benzoxazine-based composites for electrically conductive adhesives (ECAs) applications
    Matkaran, Kriengkrai
    Thubsuang, Uthen
    Wongkasemjit, Sujitra
    Chaisuwan, Thanyalak
    ABSTRACTS OF PAPERS OF THE AMERICAN CHEMICAL SOCIETY, 2016, 251
  • [33] Experimental study and mechanism analysis on the effect of pre-curing time on the microstructure and mechanical properties of magnetorheological elastomers under compression
    Zhang, Jiangtao
    Zhu, Lei
    Guo, Xiang
    Qiao, Yanliang
    Zhang, Mei
    Zhai, Pengcheng
    JOURNAL OF MAGNETISM AND MAGNETIC MATERIALS, 2024, 604
  • [34] Analysis of the Curing Process of Electrically Conductive Adhesives Using Taguchi Approach and Full Factorial Experiments Approach
    Seba Barto
    Pavel Mach
    Arabian Journal for Science and Engineering, 2014, 39 : 4935 - 4944
  • [35] Influence of post-curing and coupling agents on polyurethane based copper filled electrically conductive adhesives
    Li-Ngee Ho
    Hiroshi Nishikawa
    Journal of Materials Science: Materials in Electronics, 2013, 24 : 2077 - 2081
  • [36] Analysis of the Curing Process of Electrically Conductive Adhesives Using Taguchi Approach and Full Factorial Experiments Approach
    Barto, Seba
    Mach, Pavel
    ARABIAN JOURNAL FOR SCIENCE AND ENGINEERING, 2014, 39 (06) : 4935 - 4944
  • [37] Influence of post-curing and coupling agents on polyurethane based copper filled electrically conductive adhesives
    Ho, Li-Ngee
    Nishikawa, Hiroshi
    JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2013, 24 (06) : 2077 - 2081
  • [39] Study of compatibility of silicone-based electrically conductive adhesives and conductive backsheets for MWT modules
    Beaucarne, Guy
    Broek, Kees
    Chislea, Brian
    Yu, Yanghai
    Wei, Jason
    Zambova, Adriana
    Bennett, Ian
    PROCEEDINGS OF THE 4TH INTERNATIONAL CONFERENCE ON CRYSTALLINE SILICON PHOTOVOLTAICS (SILICONPV 2014), 2014, 55 : 444 - 450
  • [40] The electrical and mechanical properties of electrically conductive adhesives in pin-through-hole applications
    Morris, JE
    Feng, XF
    Lee, CL
    Oakley, E
    Youssof, S
    JOURNAL OF ELECTRONICS MANUFACTURING, 1996, 6 (03): : 219 - 230