共 5 条
- [1] Effect of Bi addition on interfacial microstructures and properties of Sn-1.0Ag-0.5Cu Pb-free solder joints during isothermal aging and thermal cycling Hanjie Xuebao/Transactions of the China Welding Institution, 2022, 43 (11): : 157 - 162
- [2] Thermal Stability of Bi in Sn-Cu Based High Strength Pb-Free Solder Alloys 2024 International Conference on Electronics Packaging, ICEP 2024, 2024, : 81 - 82
- [5] Dynamic mechanical properties and failure mechanism of saturated coal-measure sandstone in open pit mine with damage under real-time low-temperature conditions Meitan Xuebao/Journal of the China Coal Society, 2022, 47 (03): : 1168 - 1179