Research on Polynomial Regression Machine Learning Model with K-Means Algorithm for Predicting Advanced Packaging Reliability

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作者：

National Tsing Hua University, Department of Power Mechanical Engineering, Hsinchu, Taiwan ^{[1
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来源：

Int. Conf. Electron. Packag., ICEP | 2022年 / 143-144期

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摘要：

Chip scale packages - Cluster analysis - Finite element method - Forecasting - K-means clustering - Polynomials - Regression analysis

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