Size Effects of Growth and Evolution of Interfacial Intermetallic Compound and the Mechanical Behavior of Bump Structure Sn3.0Ag0.5Cu/Cu Cross-scale Joints in Electronic Packages

被引：0

作者：

Zhou, Minbo ^{[1
,2
]}

Zhao, Xingfei ^{[1
,2
]}

Chen, Mingqiang ^{[1
,2
]}

Ke, Changbo ^{[1
,2
]}

Zhang, Xinping ^{[1
,2
]}

机构：

[1] School of Materials Science and Engineering, South China University of Technology, Guangzhou,510640, China

[2] Guangdong Provincial Engineering R&D Center of Electronic Packaging Materials and Reliability, South China University of Technology, Guangzhou,510640, China

来源：

Jixie Gongcheng Xuebao/Journal of Mechanical Engineering | 2022年 / 58卷 / 02期

关键词：

Compendex;

D O I：

暂无

中图分类号：

学科分类号：

摘要：

Intermetallics

引用

页码：259 / 268