Influence of Si on the Elevated-Temperature Mechanical and Creep Properties of Al-Cu 224 Cast Alloys during Thermal Exposure

The influence of Si content (0.1-0.8 wt.%) on the development of precipitation microstructures and the resultant mechanical and creep properties during thermal exposure, up to 1000 h at 300 degrees C, in Al-Cu 224 cast alloys, was systematically investigated. The room and elevated temperature yield strength (YS) increased with increasing Si content under the T7 condition, which was attributed to the fact that the Si promoted the precipitation of fine theta '. However, Si increased the coarsening of theta ' during thermal exposure at 300 degrees C, and the alloys with low Si exhibited a higher YS and creep resistance at elevated temperatures than high Si alloys. The mechanical strength and creep resistance were mainly controlled by the precipitation strengthening of the predominant theta ' phase. Because of the high mechanical strength and creep resistance of the 0.1Si alloy during long-term thermal exposure, the Si level in Al-Cu alloys should be maintained at a low level of 0.1 wt.% for high-temperature applications. The strengthening mechanisms were quantitatively analyzed, based on the characteristics of the precipitate. The predicted YS values under different exposure conditions agreed well with the experimentally measured values.