Calculation of Cable SGEMP Response for PCB Trace Based on Finite Element Method

被引：0
|
作者：
Zhang, Maoxing [1 ,2 ]
Meng, Cui [3 ]
Liu, Yinong [1 ,2 ]
机构：
[1] Tsinghua Univ, Dept Engn Phys, Beijing 100084, Peoples R China
[2] Minist Educ, Key Lab Particle & Radiat Imaging, Beijing 100084, Peoples R China
[3] Zhejiang Univ, Coll Elect Engn, Hangzhou, Peoples R China
来源：
IEEE TRANSACTIONS ON NUCLEAR SCIENCE | 2024年 / 71卷 / 11期
关键词：
Substrates; Power cables; Electrons; Printed circuits; Metals; Dielectrics; Integrated circuit modeling; Finite element method (FEM); printed circuit board (PCB); system-generated electromagnetic pulse (SGEMP); X-ray; SIMULATION; CAVITY;
D O I：
10.1109/TNS.2024.3439609
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
When a printed circuit board (PCB) is irradiated by transient X-ray, photoelectrons will be emitted due to the photoelectric effect, resulting in coupling current response on the metal trace, which may interfere with or damage the components connected to the trace. This article derives the transmission line equation of PCB trace under X-ray irradiation and establishes a simulation code based on the finite element method (FEM), which can more accurately express the distribution of deposited charges in the substrate, making the simulation results more accurate. The effects of some parameters (such as trace width, substrate thickness, and bias voltage) on the coupling response were simulated and analyzed.
引用
收藏
页码：2361 / 2376
页数：16
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