In-situ Observation of Underfill Dispensing Process

被引：0
|
作者：
Hu, Dyi Chung [1 ]
Hao Chen, Erh [1 ]
Lee, Jeffrey Changbing [2 ]
Peng Sun, Chia [3 ]
Liang, Yu En [3 ]
机构：
[1] SiPlus Co., Hsinchu, Taiwan
[2] Integrated Service Technology Inc., Hsinchu, Taiwan
[3] CoreTech System (Moldex3D), Zhubei, Taiwan
来源：
2023 International Conference on Electronics Packaging, ICEP 2023 | 2023年
关键词：
Compilation and indexing terms; Copyright 2024 Elsevier Inc;
D O I：
暂无
中图分类号：
学科分类号：
摘要：
Chip scale packages - Passivation
引用
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页码：57 / 58
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