In-situ Observation of Underfill Dispensing Process

被引：0

作者：

Hu, Dyi Chung ^{[1
]}

Hao Chen, Erh ^{[1
]}

Lee, Jeffrey Changbing ^{[2
]}

Peng Sun, Chia ^{[3
]}

Liang, Yu En ^{[3
]}

机构：

[1] SiPlus Co., Hsinchu, Taiwan

[2] Integrated Service Technology Inc., Hsinchu, Taiwan

[3] CoreTech System (Moldex3D), Zhubei, Taiwan

来源：

2023 International Conference on Electronics Packaging, ICEP 2023 | 2023年

关键词：

D O I：

暂无

中图分类号：

学科分类号：

摘要：

Chip scale packages - Passivation

引用

页码：57 / 58

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