Nanoscale structural and electrical evolution of Ta- and Ti-based contacts on AlGaN/GaN heterostructures

被引:0
|
作者
机构
[1] Greco, G.
[2] Giannazzo, F.
[3] Iucolano, F.
[4] Lo Nigro, R.
[5] Roccaforte, F.
来源
| 1600年 / American Institute of Physics Inc.卷 / 114期
关键词
In this paper; the nanoscale structural and electrical evolution of Ta- and Ti-based contacts was investigated employing several analytical techniques. A correlation between the improvement of the electrical quality of the contacts and the formation of Al-alloyed phases (TaAl3 or TiAl3) during annealing was observed. However; while for the Ti/Al contacts an Ohmic behavior with a contact resistance Rc ∼ 1.8 Ω mm has been achieved after annealing at 500 °C; Ta/Al contacts exhibited a higher contact resistance (Rc ∼ 36.3 Ω·mm) even after annealing at 700 °C. The different electrical behaviour has been explained considering the different interface and the homogeneity of the current transport at a nanoscale level. © 2013 AIP Publishing LLC;
D O I
暂无
中图分类号
学科分类号
摘要
Journal article (JA)
引用
收藏
相关论文
共 50 条
  • [41] Alloyed Si/Al-based ohmic contacts to AlGaN/GaN nitride heterostructures
    Slapovskiy, D. N.
    Pavlov, A. Yu.
    Pavlov, V. Yu.
    Klekovkin, A. V.
    SEMICONDUCTORS, 2017, 51 (04) : 438 - 443
  • [42] Mo/Al/Mo/Au-based ohmic contacts to AlGaN/GaN heterostructures
    Kondakov M.N.
    Chernykh S.V.
    Chernykh A.V.
    Gladysheva N.B.
    Dorofeev A.A.
    Didenko S.I.
    Shcherbachev K.D.
    Tabachkova N.Y.
    Kaprov D.B.
    Russian Microelectronics, 2016, 45 (6) : 402 - 409
  • [43] Electrical characterization and surface morphology of optimized Ti/Al/Ti/Au ohmic contacts for AlGaN/GaN HEMTs
    Bardwell, JA
    Haffouz, S
    Tang, H
    Wang, R
    JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 2006, 153 (08) : G746 - G749
  • [44] Structural analysis of interfacial layers in Ti/Ta/Al ohmic contacts to n-AlGaN
    Lim, SH
    Swider, W
    Washburn, J
    Liliental-Weber, Z
    JOURNAL OF APPLIED PHYSICS, 2000, 88 (11) : 6364 - 6368
  • [45] Structural properties of alloyed Ti/Al/Ti/Au and Ti/Al/Mo/Au ohmic contacts to AlGaN/GaN
    Vertiatchikh, Alexei
    Kaminsky, Ed
    Teetsov, Julie
    Robinson, Kevin
    SOLID-STATE ELECTRONICS, 2006, 50 (7-8) : 1425 - 1429
  • [46] Role of Ti/Al relative thickness in the formation mechanism of Ti/Al/Ni/Au Ohmic contacts to AlGaN/GaN heterostructures
    Kong, Xin
    Wei, Ke
    Liu, Guoguo
    Liu, Xinyu
    JOURNAL OF PHYSICS D-APPLIED PHYSICS, 2012, 45 (26)
  • [47] Experimental Investigation of As Preamorphization Implant on Electrical Property of Ti-Based Silicide Contacts
    Mao, Shujuan
    Zhao, Chao
    Liu, Jinbiao
    Wang, Guilei
    Zhang, Yongkui
    Wang, Yao
    Cui, Hengwei
    Liu, Weibing
    Li, Menghua
    Liu, Yaodong
    Zhang, Dan
    Xu, Jing
    Gao, Jianfeng
    Li, Yongliang
    Wang, Wenwu
    Chen, Dapeng
    Li, Junfeng
    Ye, Tianchun
    Luo, Jun
    IEEE TRANSACTIONS ON ELECTRON DEVICES, 2021, 68 (04) : 1835 - 1840
  • [48] Current conduction mechanism of Si/Ti-based Ohmic contacts to n-GaN
    Kim, DW
    Baik, HK
    APPLIED PHYSICS LETTERS, 2000, 77 (07) : 1011 - 1013
  • [49] Material investigations for improving stability of Au free Ta/Al-based ohmic contacts annealed at low temperature for AlGaN/GaN heterostructures
    Calzolaro, Anthony
    Hentschel, Rico
    Edokam, Ifeanyi Francis
    Sizov, Victor
    Mikolajick, Thomas
    Wachowiak, Andre
    SEMICONDUCTOR SCIENCE AND TECHNOLOGY, 2020, 35 (07)
  • [50] Nonalloyed ohmic contacts for high-electron-mobility transistors based on AlGaN/GaN heterostructures
    Pavlov A.Y.
    Pavlov V.Y.
    Slapovskiy D.N.
    Arutyunyan S.S.
    Fedorov Y.V.
    Mal’tsev P.P.
    Russian Microelectronics, 2017, 46 (5) : 316 - 322