Review of low-temperature bonding technologies and their application in optoelectronic devices

被引：0
|
作者：
Higurashi, Eiji [1 ]
Suga, Tadatomo [2 ]
机构：
[1] Research Center for Advanced Science and Technology, University of Tokyo 4-6-1, Meguro-ku, Tokyo 153-8904, Japan
[2] School of Engineering, University of Tokyo 7-3-1, Bunkyo-ku, Tokyo 113-8656, Japan
来源：
IEEJ Transactions on Sensors and Micromachines | 2014年 / 134卷 / 06期
关键词：
51;
D O I：
10.1541/ieejsmas.134.159
中图分类号：
学科分类号：
摘要：
引用
收藏
页码：159 / 165
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