Review of low-temperature bonding technologies and their application in optoelectronic devices

被引：0
作者：
Higurashi, Eiji [1 ]
Suga, Tadatomo [2 ]
机构：
[1] Research Center for Advanced Science and Technology, University of Tokyo 4-6-1, Meguro-ku
[2] School of Engineering, University of Tokyo 7-3-1, Bunkyo-ku
来源：
IEEJ Transactions on Sensors and Micromachines | 2014年 / 134卷 / 06期
基金：
日本学术振兴会;
关键词：
Low-temperature bonding; Optoelectronics; Room-temperature bonding; Wafer bonding;
D O I：
10.1541/ieejsmas.134.159
中图分类号：
学科分类号：
摘要：
Low-temperature bonding is an important fabrication technique for advanced microelectronic, MEMS (Micro electro mechanical systems) and optoelectronic devices. Recently, many low-temperature bonding methods such as surface activated bonding have been studied to create unique device structures for a wide range of photonics applications. This paper focuses on low temperature bonding technologies and reviews the state-of-the-art applications in optoelectronic devices. © 2014 The Institute of Electrical Engineers of Japan.
引用
收藏
页码：159 / 165
页数：6
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