Review of low-temperature bonding technologies and their application in optoelectronic devices

被引：0

作者：

Higurashi, Eiji ^{[1
]}

Suga, Tadatomo ^{[2
]}

机构：

[1] Research Center for Advanced Science and Technology, University of Tokyo 4-6-1, Meguro-ku, Tokyo 153-8904, Japan

[2] School of Engineering, University of Tokyo 7-3-1, Bunkyo-ku, Tokyo 113-8656, Japan

来源：

IEEJ Transactions on Sensors and Micromachines | 2014年 / 134卷 / 06期

关键词：

51;

D O I：

10.1541/ieejsmas.134.159

中图分类号：

学科分类号：

摘要：

引用

页码：159 / 165

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