Investigation and Classification of Short-Circuit Failure Modes Based on Three-Dimensional Safe Operating Area for High-Power IGBT Modules

被引:63
作者
Chen, Yuxiang [1 ]
Li, Wuhua [1 ]
Iannuzzo, Francesco [2 ]
Luo, Haoze [1 ,2 ]
He, Xiangning [1 ]
Blaabjerg, Frede [2 ]
机构
[1] Zhejiang Univ, Coll Elect Engn, Hangzhou 310027, Zhejiang, Peoples R China
[2] Aalborg Univ, Energy Technol Dept, DK-9220 Aalborg, Denmark
基金
中国国家自然科学基金;
关键词
High power insulated-gate bipolar transistors (IGBTs); short-circuit failure mode; three-dimensional short-circuit safe operating area (3D-SCSOA); self-heating; temperature dependence; HIGH-VOLTAGE IGBTS; FIELD-STOP IGBTS; COLLECTOR DESIGN; TURN-OFF; RUGGEDNESS; AVALANCHE; DEVICES; LIMITATION; BEHAVIOR;
D O I
10.1109/TPEL.2017.2682114
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Insulated-gate bipolar transistor (IGBT) shortcircuit failure modes have been under research for many years, successfully paving the way for device short-circuit ruggedness improvement. The aim of this paper is to classify and discuss recent contributions about IGBT short-circuit failure modes, in order to establish the current state of the art and trends in this area. First, the concept of 3-D safe operating area is proposed as the IGBT's operational boundary to divide the device short-circuit failure modes into short-circuit V-DC/V-rated-I-SC SOA limiting and short-circuit endurance time limiting groups. Then, the discussion is centered on currently reported IGBT short-circuit failure modes in terms of their relationships with the device 3-D short-circuit safe operating area (3D-SCSOA) characteristics. In addition, further investigation on the interaction of 3D-SCSOA characteristics is implemented to motivate advanced contributions in future dependence research of device short-circuit failure modes on temperature. Consequently, a comprehensive and thoughtful review of where the development of short-circuit failure mode research works of IGBT stands and is heading is provided.
引用
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页码:1075 / 1086
页数:12
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