High power insulated-gate bipolar transistors (IGBTs);
short-circuit failure mode;
three-dimensional short-circuit safe operating area (3D-SCSOA);
self-heating;
temperature dependence;
HIGH-VOLTAGE IGBTS;
FIELD-STOP IGBTS;
COLLECTOR DESIGN;
TURN-OFF;
RUGGEDNESS;
AVALANCHE;
DEVICES;
LIMITATION;
BEHAVIOR;
D O I:
10.1109/TPEL.2017.2682114
中图分类号:
TM [电工技术];
TN [电子技术、通信技术];
学科分类号:
0808 ;
0809 ;
摘要:
Insulated-gate bipolar transistor (IGBT) shortcircuit failure modes have been under research for many years, successfully paving the way for device short-circuit ruggedness improvement. The aim of this paper is to classify and discuss recent contributions about IGBT short-circuit failure modes, in order to establish the current state of the art and trends in this area. First, the concept of 3-D safe operating area is proposed as the IGBT's operational boundary to divide the device short-circuit failure modes into short-circuit V-DC/V-rated-I-SC SOA limiting and short-circuit endurance time limiting groups. Then, the discussion is centered on currently reported IGBT short-circuit failure modes in terms of their relationships with the device 3-D short-circuit safe operating area (3D-SCSOA) characteristics. In addition, further investigation on the interaction of 3D-SCSOA characteristics is implemented to motivate advanced contributions in future dependence research of device short-circuit failure modes on temperature. Consequently, a comprehensive and thoughtful review of where the development of short-circuit failure mode research works of IGBT stands and is heading is provided.