Numerical analysis for thermal design of electronic equipment using phase change material

被引：2

作者：

Lee D.K. ^{[1
]}

Lee W.H. ^{[1
]}

Park S.W. ^{[1
]}

Kang S.W. ^{[1
]}

Cho J.H. ^{[2
]}

机构：

[1] Dept. of Mechanical Engineering, R and D Lab.

来源：

Lee, Dong Kyun (dongkyun.lee@lignex1.com) | 1600年 / Korean Society of Mechanical Engineers卷 / 41期

关键词：

Electronic module; Equivalent specific heat method; Numerical simulation; Phase change material;

D O I：

10.3795/KSME-B.2017.41.4.285

中图分类号：

学科分类号：

摘要：

In this study, a case analysis for thermal design of electronic equipment using a phase change material(PCM) was performed numerically using ANSYS Fluent. Experiments were conducted to find the temperature increase(δTm), melting temperature(Tm), and volume expansion of the PCM under the melting process. To verify the accuracy of the Fluent solver model, Tm, δTm, and the melting time were compared with experimental results. To simulate the temperature stagnation phenomenon under the melting process, the equivalent specific heat method was applied to calculate the thermal properties of the PCM in the solver model. To determine the thermal stability of electronic equipment, we paid special attention to finding a thermal design for the PCM using fins. Further, an additional numerical analysis is currently underway to find an optimum design. © 2017 The Korean Society of Mechanical Engineers.

引用

页码：285 / 291

页数：6

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