The integrated circuit packaging scheduling problem (ICPSP): A case study

被引：0

作者：

Pearn, W.L. ^{[1
]}

Chung, S.H. ^{[1
]}

Yang, M.H. ^{[2
]}

Chen, C.Y. ^{[1
]}

机构：

[1] Department of Industrial Engineering and Management, National Chiao Tung University, Hsinchu, Taiwan

[2] Department of Business Management, National United University, Miao Li, Taiwan

来源：

Int J Ind Eng Theory Appl Pract | / 3卷 / 296-307期

关键词：

Compendex;

D O I：

暂无

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学科分类号：

摘要：

Costs - Integrated circuits - Parallel processing systems - Problem solving - Product development - Scheduling

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