High performance electrically conductive adhesives from functional epoxy, micron silver flakes, micron silver spheres and acidified single wall carbon nanotube for electronic package

被引：0

作者：

Cui, Hui-Wang ^{[1
,2
,3
]}

Kowalczyk, Agnieszka ^{[4
]}

Li, Dong-Sheng ^{[1
]}

Fan, Qiong ^{[1
]}

机构：

[1] [1,2,Cui, Hui-Wang

[2] Kowalczyk, Agnieszka

[3] Li, Dong-Sheng

[4] Fan, Qiong

来源：

Cui, H.-W. (cuihuiwang@hotmail.com) | 1600年 / Elsevier Ltd卷 / 44期

关键词：

To develop high performance electrically conductive adhesives (ECAs); bi-modal ECAs were prepared by a matrix resin; micron silver flakes and micron silver spheres; and tri-modal ECAs were prepared by a matrix resin; micron silver flakes; micron silver spheres and acidified single wall carbon nanotube (ASWCNT). With the increase of nano silver spheres; the bulk resistivity of bi-modal ECAs decreased firstly and then increased while tri-modal ECAs' bulk resistivity firstly increased and then decreased with the increase of ASWCNT due to different electrically conductive channels were formed in them. After aged for 500 h under humid and thermal cycle of constant humidity level of 85% relative humidity at 85 C; the contact resistance shift of bi-modal ECAs was more than 20% and that of tri-modal ECAs was less than 15% showing tri-modal ECAs had lower and more stable contact resistance. The humid and thermal surroundings had bad effect on the mechanical properties of bi- and tri-modal ECAs; after aged for 500 h; they both were reduced about 50-65%. And a bi-modal ECAs and a tri-modal ECAs were optimized and investigated in detail which can be used in electronic packaging. © 2013 Elsevier Ltd;

D O I：

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中图分类号：

学科分类号：

摘要：

Journal article (JA)

引用

页码：220 / 225

共 13 条

[1] High performance electrically conductive adhesives from functional epoxy, micron silver flakes, micron silver spheres and acidified single wall carbon nanotube for electronic package
Cui, Hui-Wang
Kowalczyk, Agnieszka
Li, Dong-Sheng
Fan, Qiong
INTERNATIONAL JOURNAL OF ADHESION AND ADHESIVES, 2013, 44 : 220 - 225
[2] Using a functional epoxy, micron silver flakes, nano silver spheres, and treated single-wall carbon nanotubes to prepare high performance electrically conductive adhesives
Hui-Wang Cui
Dong-Sheng Li
Qiong Fan
Electronic Materials Letters, 2013, 9 : 299 - 307
[3] Using a functional epoxy, micron silver flakes, nano silver spheres, and treated single-wall carbon nanotubes to prepare high performance electrically conductive adhesives
Cui, Hui-Wang
Li, Dong-Sheng
Fan, Qiong
ELECTRONIC MATERIALS LETTERS, 2013, 9 (03) : 299 - 307
[4] Surface treatment of micron silver flakes with coupling agents for high-performance electrically conductive adhesives
Zhang, Weiwei
Wang, Jintao
Liu, Hao
Zhang, Zheng
Wang, Jianqiang
Zhang, Luobin
Wang, Haozhong
Wang, Fengyi
Duan, Fangcheng
Liu, Jiahao
Li, Mingyu
Hang, Chunjin
Chen, Hongtao
INTERNATIONAL JOURNAL OF ADHESION AND ADHESIVES, 2023, 122
[5] Surface treatment of micron silver flakes with coupling agents for high-performance electrically conductive adhesives
Zhang, Weiwei
Wang, Jintao
Liu, Hao
Zhang, Zheng
Wang, Jianqiang
Zhang, Luobin
Wang, Haozhong
Wang, Fengyi
Duan, Fangcheng
Liu, Jiahao
Li, Mingyu
Hang, Chunjin
Chen, Hongtao
International Journal of Adhesion and Adhesives, 2023, 122
[6] Novel flexible electrically conductive adhesives from functional epoxy, flexibilizers, micro-silver flakes and nano-silver spheres for electronic packaging
Cui, Hui-wang
Fan, Qiong
Li, Dong-sheng
POLYMER INTERNATIONAL, 2013, 62 (11) : 1644 - 1651
[7] Surface functionalization of micro silver flakes and their application in electrically conductive adhesives for electronic package
Cui, Hui-Wang
Fan, Qiong
Li, Dong-Sheng
INTERNATIONAL JOURNAL OF ADHESION AND ADHESIVES, 2014, 48 : 177 - 182
[8] Surface functionalization of micro silver flakes and their application in electrically conductive adhesives for electronic package
Cui, H.-W. (cuihuiwang@hotmail.com), 1600, Elsevier Ltd (48):
[9] SILVER FLAKES FILLED INTERPENETRATING POLYMER NETWORK : HIGH PERFORMANCE ELECTRICALLY CONDUCTIVE ADHESIVES FOR ELECTRONIC PACKAGING
Han, Yankang
Zhang, Baotan
Zhu, Pengli
Huang, Shulei
Sun, Rong
Wong, Chingping
2016 CHINA SEMICONDUCTOR TECHNOLOGY INTERNATIONAL CONFERENCE (CSTIC), 2016,
[10] Surface Functionalization of Micrometer Silver Flakes for Fabricating High-Performance Electrically Conductive Adhesives
Zhang, Weiwei
Liu, Jiahao
Liu, Hao
Wang, Jianqiang
Zhang, Luobin
Wang, Jintao
Wang, Haozhong
Wang, Fengyi
Wang, Xinjie
Yu, Fuwen
Lv, Ziwen
Zhang, Zheng
Hang, Chunjin
Li, Mingyu
Chen, Hongtao
ACS APPLIED ELECTRONIC MATERIALS, 2022, 4 (11) : 5387 - 5396

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