Transient Thermal Evaluation for Integrated Motor Control System with Multiple Dynamic Heat Sources

被引：0

作者：

Chiriac, Victor Adrian ^{[1
]}

Lee, Tien-Yu Tom ^{[1
]}

Bien, David ^{[2
]}

机构：

[1] Semiconductor Products Sector, Final Mfg. Technology Center, Motorola Inc., 2100 Elliot Road, Tempe, AZ 85284, United States

[2] Analog Products Division, Semiconductor Products Sector, Motorola Inc., 2100 E. Elliot Road, Tempe, AZ 85284, United States

来源：

American Society of Mechanical Engineers, Electronic and Photonic Packaging, EPP | 2003年 / 3卷

关键词：

Compendex;

D O I：

暂无

中图分类号：

学科分类号：

摘要：

Approximation theory - Boundary conditions - Chip scale packages - Computer simulation - Control system analysis - Heat resistance - Thermal conductivity - Thermal diffusion - Thermal effects - Transients

引用

页码：447 / 453