Application of nano-polycrystalline diamond to wear resistant tools

被引：0
|
作者：
Kinoshita, Takuya [1 ]
Yukawa, Makoto [1 ]
Seki, Yuichiro [1 ]
Kimura, Koichiro [1 ]
机构：
[1] A.L.M.T. Corp.
来源：
SEI Technical Review | 2019年 / 89期
关键词：
Coremaking - Wear of materials - Wire drawing - Polycrystalline materials - Wear resistance - Diamond cutting tools - Surface roughness;
D O I：
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中图分类号：
学科分类号：
摘要：
In recent years, the quality level required for diamond dies has risen along with an improvement in the precision of wire materials such as semiconductor bonding wires and medical wires. Requirements are increasing for wire characteristics, particularly wear resistance and properties to maintain roundness and wire surface roughness. In order to meet the needs, we have developed the BLPCD die using a nano-polycrystalline diamond (Sumidia binderless) developed by Sumitomo Electric Industries, Ltd. as its core material. This paper reports the performance evaluation results. © 2019 Sumitomo Electric Industries Ltd.. All rights reserved.
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页码：48 / 51
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