Through the looking glass continued (III): Update to trends in solid-state circuits and systems from ISSCC 2014

被引：0

作者：

Narendra, Siva ^{[1
]}

Fujino, Laura C. ^{[2
]}

Smith, Kenneth C. ^{[2
]}

机构：

[1] Tyfone, Portland, OR

来源：

IEEE Solid-State Circuits Magazine | 2014年 / 6卷 / 01期

关键词：

Glass;

D O I：

10.1109/MSSC.2013.2289636

中图分类号：

学科分类号：

摘要：

A two-part article, Through the Looking Glass II" was published last year (in the Winter 2013 and Spring 2013 issues of IEEE Solid-State Circuits Magazine) to discuss the trends in solid-state circuits and systems based on papers selected by the program subcommittees of IEEE International Solid-State Circuits Conference (ISSCC) 2013. This article highlights additions to those trends based on technical papers that are selected to be presented at ISSCC 2014. © 2009-2012 IEEE."

引用

页码：49 / 53

页数：4