Low-Complexity Direct and Iterative Volume Integral Equation Solvers with a Minimal-Rank H2-Representation for Large-Scale Three-Dimensional Electrodynamic Analysis

被引:13
|
作者
Omar S. [1 ]
Ma M. [1 ]
Jiao D. [1 ]
机构
[1] School of Electrical and Computer Engineering, Purdue University, West Lafayette, 47907, IN
来源
Jiao, Dan (djiao@purdue.edu) | 1600年 / Institute of Electrical and Electronics Engineers Inc., United States卷 / 02期
基金
美国国家科学基金会;
关键词
Electrodynamic; electromagnetic modeling; fast direct solvers; fast solvers; linear complexity solvers; radiation; scattering; three-dimensional (3-D) structures; volume integral equations (VIE);
D O I
10.1109/JMMCT.2017.2764683
中图分类号
学科分类号
摘要
Low-complexity iterative and direct solvers are developed for the volume integral equation (VIE) based general large-scale electrodynamic analysis. The dense VIE system matrix is first represented by a new cluster-based multilevel low-rank representation. In this representation, all the admissible blocks associated with a single cluster are grouped together and represented by a single low-rank block, whose rank is minimized based on prescribed accuracy. From such an initial representation, an efficient algorithm is developed to generate a minimal-rank H2-matrix representation. This representation facilitates faster computation, and ensures the same minimal rank's growth rate with electrical size as evaluated from singular value decomposition. For the minimal-rank representation whose rank grows with electrical size linearly for a prescribed accuracy, we develop linear-complexity H2 -matrix-based storage and matrix-vector multiplication, and thereby an O(N) iterative VIE solver. Moreover, we develop an O(NlogN) matrix inversion, and hence a fast O(NlogN) direct VIE solver for large-scale electrodynamic analysis. Both theoretical analysis and numerical simulations of large-scale one-, two-, and three-dimensional structures on a single-core CPU, resulting in millions of unknowns, have demonstrated the low complexity and superior performance of the proposed VIE electrodynamic solvers. © 2017 IEEE.
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页码:210 / 223
页数:13
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