Rheological behaviors of the high temperature resistant bismaleimide resin system

被引:0
|
作者
机构
[1] [1,Wang, Fangfang
[2] 1,Zhang, Yanfei
[3] 1,Du, Ruikui
[4] 1,Liu, Yaqing
[5] 1,Zhao, Guizhe
来源
Liu, Y. (zfflyq98@163.com) | 1600年 / Sichuan University卷 / 29期
关键词
D O I
暂无
中图分类号
学科分类号
摘要
6
引用
收藏
相关论文
共 50 条
  • [1] Studies on rheological behaviors of bismaleimide resin system for resin transfer molding
    Lu, Yao
    Duan, Yue-Xin
    Liang, Zhi-Yong
    1600, Chinese Journal of Aeronautics (15):
  • [2] Rheological behavior of a bismaleimide resin system for RTM process
    School of Materials Science and Engineering, Beijing University of Aeronautics and Astronautics, Beijing 100083, China
    Fuhe Cailiao Xuebao, 2006, 1 (56-62):
  • [3] Rheological behavior of a bismaleimide resin system for RTM process
    Duan Y.
    Shi F.
    Liang Z.
    Zhang Z.
    Frontiers of Materials Science in China, 2007, 1 (1): : 97 - 104
  • [4] Rheological and curing behaviors of high heat-resistant benzoxazine resin
    Zhang, Li
    Zhang, Yihe
    Wang, Lei
    Yao, Yalin
    Wang, Liang
    Wang, Hongguang
    Wu, Juntao
    Tian, Moufeng
    POLYMER TESTING, 2018, 69 : 214 - 218
  • [5] Curing behavior and properties of ultra-high temperature resistant RTM bismaleimide resin
    Xiong, Xuhai
    Ai, Jianxin
    Ren, Rong
    Wang, Jing
    Li, Guiyang
    HIGH PERFORMANCE POLYMERS, 2023, 35 (05) : 469 - 479
  • [6] Study on the curing reaction and rheological behavior of Bismaleimide resin
    Sun, Qiuju
    Wang, Kunyuan
    Wu, Shiwei
    Dai, Li
    ADVANCED MATERIALS AND PROCESSES III, PTS 1 AND 2, 2013, 395-396 : 407 - +
  • [7] CHARACTERIZATION OF A BISBENZOCYCLOBUTENE HIGH-TEMPERATURE RESIN AND A BISBENZOCYCLOBUTENE BLENDED WITH A COMPATIBLE BISMALEIMIDE RESIN
    DENNY, LR
    GOLDFARB, IJ
    FARR, MP
    ABSTRACTS OF PAPERS OF THE AMERICAN CHEMICAL SOCIETY, 1987, 193 : 149 - PMSE
  • [8] CHARACTERIZATION OF BISBENZOCYCLOBUTENE HIGH-TEMPERATURE RESIN AND BISBENZOCYCLOBUTENE BLENDED WITH A COMPATIBLE BISMALEIMIDE RESIN
    DENNY, LR
    GOLDFARB, IJ
    FARR, MP
    ACS SYMPOSIUM SERIES, 1988, 367 : 366 - 378
  • [10] Curing kinetics and TTT diagram of high temperature resistance bismaleimide resin
    Li W.-D.
    Zhang J.-D.
    Li S.-L.
    Liu G.
    Zhong X.-Y.
    Bao J.-W.
    Cailiao Gongcheng/Journal of Materials Engineering, 2016, 44 (09): : 44 - 51