How Inkjet Technology is Increasing Opportunity in Packaging

被引：0
作者：
Cross, Lisa
机构：
来源：
Package Printing | 2020年 / 67卷 / 07期
关键词：
Packaging;
D O I：
暂无
中图分类号：
学科分类号：
摘要：
Inkjet printing is lowering entry barriers for providers looking to digitally print packaging, according to the results of a new NAPCO Research report. Looking to identify trends and key influences prompting providers to pursue digital printing of packaging, NAPCO Research (a unit of NAPCO Media LLC.
引用
收藏
相关论文
共 50 条
  • [41] A continuous system for digital package printing: Technology matched to good packaging ideas
    Deutscher Drucker Stuttgart, 2002, 38 (22): : 40 - 42
  • [42] 3-D Embedded Packaging Technology: Analyzing its needs and challenges
    Anagensis, Inc., United States
    不详
    不详
    不详
    IEEE Power Electron. Mag., 4 (30-39): : 30 - 39
  • [43] Standardization of Export Packaging Technology for Jasmine (Jasminum sambac Ait.) Flowers
    Jawaharlal, M.
    Thamaraiselvi, S. P.
    Ganga, M.
    INTERNATIONAL CONFERENCE ON QUALITY MANAGEMENT IN SUPPLY CHAINS OF ORNAMENTALS QMSCO2012, 2013, 970 : 81 - 91
  • [44] Tasteful Packaging: How health and ethical messaging can affect the consumer experience
    Niedziela, Michelle M.
    Jordan, Amanda
    Stone, Hannah
    AGRO FOOD INDUSTRY HI-TECH, 2016, 27 (03): : 34 - 37
  • [45] Packaging journey from retail to home: how the meaning of sustainability for colour transforms
    Sekki, Sanna
    Kauppinen-Raisanen, Hannele
    Kylkilahti, Eliisa
    Autio, Minna
    INTERNATIONAL JOURNAL OF RETAIL & DISTRIBUTION MANAGEMENT, 2023, 51 (13) : 47 - 63
  • [46] Experimental Research on Vacuum Fresh-keeping Packaging Technology of Rice and Dynamical Model
    Gong, Xue
    PACKAGING SCIENCE AND TECHNOLOGY, 2012, 200 : 462 - 465
  • [47] Packaging and testing of multi-wavelength DFB laser array using REC technology
    Ni, Yi
    Kong, Xuan
    Gu, Xiaofeng
    Chen, Xiangfei
    Zheng, Guanghui
    Luan, Jia
    OPTICS COMMUNICATIONS, 2014, 312 : 123 - 126
  • [48] Study on Bonding Technology Parameter Optimize of MEMS Packaging Based on Robust Parameter Design
    Yu, Jinwei
    EQUIPMENT MANUFACTURING TECHNOLOGY, 2012, 422 : 370 - 374
  • [49] Industrial mmWave Radar Sensor in Embedded Wafer-Level BGA Packaging Technology
    Beck, Christopher
    Ng, Herman Jalli
    Agethen, Roman
    PourMousavi, Mehran
    Forstner, Hans Peter
    Wojnowski, Maciej
    Pressel, Klaus
    Weigel, Robert
    Hagelauer, Amelie
    Kissinger, Dietmar
    IEEE SENSORS JOURNAL, 2016, 16 (17) : 6566 - 6578
  • [50] The application of nanosecond-pulsed laser welding technology in MEMS packaging with a shadow mask
    Luo, C
    Lin, LW
    SENSORS AND ACTUATORS A-PHYSICAL, 2002, 97-8 : 398 - 404
12345