Microstructure and properties of Cu-Ag alloy wire

被引：0

作者：

Wen, Shan ^{[1
]}

Chang, Li-Li ^{[1
]}

Shang, Xing-Jun ^{[2
]}

Li, Sheng-Li ^{[1
]}

机构：

[1] School of Material Science and Engineering, Shandong University, Jinan,250061, China

[2] Jinan Baoshida Industrial Development Co., Ltd, Jinan,250061, China

来源：

Zhongguo Youse Jinshu Xuebao/Chinese Journal of Nonferrous Metals | 2015年 / 25卷 / 06期

关键词：

Binary alloys - Extraction - Silver alloys - Copper alloys - Annealing - Hardness - X ray diffraction - Tensile strength;

D O I：

暂无

中图分类号：

学科分类号：

摘要：

The microstructures of TAg0.1 alloys were characterized by optical microscopy and X-ray diffraction. The mechanical and electrical properties of TAg0.1 alloys were studied by microhardness tester, electronic universal testing machine and conductivity indicator. The influence of producing procedures, such as extraction, drawing and annealing, on the microstructure, mechanical properties and electrical properties of TAg0.1 alloys in the molding process of Cu-Ag alloy wire was analyzed systematically. The results indicate that the strength and hardness of TAg0.1 alloys increase after the drawing process, while the elongation and conductivity decrease. The elongation and conductivity of TAg0.1 alloys increase after annealing process, while the strength and hardness decrease. The TAg0.1 alloys were gotten after extraction, drawing, annealing and drawing processes. The hardness of TAg0.1 alloys is 129.7 HV0.05, the tensile strength is 400 MPa, and the electrical conductivity is 99.5% IACS. ©, 2015, Zhongguo Youse Jinshu Xuebao/Chinese Journal of Nonferrous Metals. All right reserved.

引用

页码：1655 / 1661