Research development of SnAgCu system lead-free solders in electronics packing

被引：0
作者：
Chen, Jian-Xun [1 ]
Zhao, Xing-Ke [1 ]
Liu, Da-Yong [1 ]
Huang, Ji-Hua [1 ]
Zou, Xu-Chen [1 ]
机构：
[1] School of Materials Science and Engineering, University of Science and Technology Beijing
来源：
Cailiao Gongcheng/Journal of Materials Engineering | 2013年 / 09期
关键词：
Lead-free solder; Reliability; Review; SnAgCu system;
D O I：
10.3969/j.issn.1001-4381.2013.09.018
中图分类号：
学科分类号：
摘要：
The SnAgCu solder with a wide application was identified as the best substitute for the traditional SnPb solder in electronic assembly industry. However, this alloy had some weaknesses, such as low anti-oxidation ability, the formation of large, brittle intermetallic compounds at the solder and substrate interface, less creep and fatigue resistance of joints during service condition compared to the eutectic SnPb solder. The microstructures and properties of SnAgCu alloy can be significantly improved with the addition of alloying elements and nanoparticles. Therefore, the reliability of solder joints can be enhanced. It is beneficial for the development novel high-performance SnAgCu solder with element additives. Based on the development of SnAgCu system lead-free solders at home and abroad, this paper summarizes the effects of alloying elements and nano particles on the wettability, anti-oxidization, microstructures, solder joints reliability of SnAgCu system lead-free solders. The present problems in the process of the applications of SnAgCu system lead-free solders are reviewed, some proposals are put forward which may provide a guide for the study of SnAgCu system lead-free solders.
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页码：91 / 98
页数：7
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共 63 条
  • [1] Gain A.K., Fouzder T., Chan Y.C., Et al., The influence of addition of Al nano-particles on the microstructure and shear strength of eutectic Sn-Ag-Cu solder on Au/Ni metallized Cu pads, Journal of Alloys and Compounds, 506, 1, pp. 216-223, (2010)
  • [2] Rao B.S.S.C., Kumar K.M., Kripesh V., Et al., Tensile deformation behavior of nano-sized Mo particles reinforced SnAgCu solders, Materials Science and Engineering: A, 528, 12, pp. 4166-4172, (2011)
  • [3] Ramirez M., Henneken L., Virtanen S., Oxidation kinetics of thin copper films and wetting behavior of copper and Organic Solderability Preservatives (OSP) with lead-free solder, Applied Surface Science, 257, 15, pp. 6481-6488, (2011)
  • [4] (2008)
  • [5] Chuang C.L., Tsao L.C., Lin H.K., Et al., Effects of small amount of active Ti element additions on microstructure and property of Sn3.5Ag0.5Cu solder, Materials Science and Engineering, 558, pp. 478-484, (2012)
  • [6] Kim K.S., Huh S.H., Suganuma K., Effects of intermetallic compounds on properties of Sn-Ag-Cu lead-free soldered joints, Journal of Alloys and Compounds, 352, 1-2, pp. 226-236, (2003)
  • [7] Kotadia H.R., Mokhtari O., Clode M.P., Et al., Intermetallic compound growth suppression at high temperature in SAC solders with Zn addition on Cu and Ni-P substrates, Journal of Alloys and Compounds, 511, 1, pp. 176-188, (2012)
  • [8] Liu W.P., Bachorik P., Lee N.C., The superior drop test performance of SAC-Ti solders and its mechanism, Electronic Manufacturing Technology Symposium (IEMT), pp. 452-458, (2008)
  • [9] Choi H., Lee T., Kim Y., Et al., Improved strength of boron-doped Sn-1.0Ag-0.5Cu solder joints under aging conditions, Intermetallics, 20, 1, pp. 155-159, (2012)
  • [10] Zhang B., Ding H., Sheng X.J., Reliability study of board-level lead-free interconnections under sequential thermal cycling and drop impact, Microelectronics Reliability, 49, 5, pp. 530-536, (2009)
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