Fabrication of sub-micron structures with high aspect ratio for MEMS using deep X-ray lithography

被引：0
作者：
Ueno, Hiroshi [1 ]
Nishi, Nobuyoshi [1 ]
Sugiyama, Susumu [1 ]
机构：
[1] Ritsumeikan Univ, Shiga, Japan
来源：
Proceedings of the IEEE Micro Electro Mechanical Systems (MEMS) | 2000年
关键词：
D O I：
暂无
中图分类号：
学科分类号：
摘要：
引用
收藏
页码：596 / 601
相关论文
共 50 条
  • [41] Fabrication of Fresnel zone plates with high aspect ratio by soft X-ray lithography
    Longhua Liu
    Gang Liu
    Ying Xiong
    Jie Chen
    Chunlei Kang
    Xinlong Huang
    Yangchao Tian
    Microsystem Technologies, 2008, 14 : 1251 - 1255
  • [42] Metallization of sub-micron trenches and vias with high aspect ratio
    Siemroth, P.
    Wenzel, Ch.
    Klimes, W.
    Schultrich, B.
    Schuelke, T.
    1997, Elsevier Science S.A., Lausanne, Switzerland (308-309)
  • [43] Sub-micron high aspect ratio silicon beam etch
    O'Brien, GJ
    Monk, DJ
    Najafi, K
    DEVICE AND PROCESS TECHNOLOGIES FOR MEMS AND MICROELECTRONICS II, 2001, 4592 : 315 - 325
  • [44] CHARACTERIZATION TECHNIQUES FOR X-RAY-LITHOGRAPHY SUB-MICRON METROLOGY
    HARRELL, SA
    ALEXANDER, D
    PROCEEDINGS OF THE SOCIETY OF PHOTO-OPTICAL INSTRUMENTATION ENGINEERS, 1984, 471 : 103 - 109
  • [45] Fabrication of high aspect ratio and tilted nanostructures using extreme ultraviolet and soft x-ray interference lithography
    Mojarad, Nassir
    Kazazis, Dimitrios
    Ekinci, Yasin
    JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B, 2021, 39 (04):
  • [46] Fabrication of barrier ribs with high aspect ratio for a plasma display panel by x-ray lithography
    Ryu, Seung-Min
    Yang, Dong-Yol
    So, Jae-Yong
    Park, Lee-Soon
    JOURNAL OF MICROMECHANICS AND MICROENGINEERING, 2009, 19 (08)
  • [47] Progress in the fabrication of high-aspect-ratio zone plates by soft x-ray lithography
    Divan, R
    Mancini, DC
    Moldovan, N
    Lai, B
    Assoufid, L
    Leonard, Q
    Cerrina, F
    DESIGN AND MICROFABRICATION OF NOVEL X-RAY OPTICS, 2002, 4783 : 82 - 91
  • [48] Prototyping for high-aspect-ratio MEMS by high energy x-ray lithography using boron carbide based masks
    Malek, CK
    Nguyen, S
    MATERIALS AND DEVICE CHARACTERIZATION IN MICROMACHINING II, 1999, 3875 : 247 - 254
  • [49] An investigation of SU-8 resist adhesion in deep X-ray lithography of high-aspect-ratio structures
    Barber, RL
    Ghantasala, MK
    Divan, R
    Mancini, DC
    Harvey, EC
    DEVICE AND PROCESS TECHNOLOGIES FOR MEMS, MICROELECTRONICS, AND PHOTONICS III, 2004, 5276 : 85 - 91
  • [50] Etching of sub-micron high aspect ratio holes in oxides and polymers
    Boucher, R
    Hübner, U
    Morgenroth, W
    Roth, H
    Meyer, HG
    Schmidt, M
    Eich, M
    MICROELECTRONIC ENGINEERING, 2004, 73-4 : 330 - 335
12345