Analysis of signal integrity of UBM and bump interconnection

被引：0
|
作者：
Liang, Ying [1 ]
Lin, Xunchao [2 ]
Huang, Chunyue [3 ]
Shao, Liangbin [3 ]
Zhang, Xin [1 ]
机构：
[1] Department of Electronic Engineering, Chengdu Aeronautic Vocational and Technical College, Chengdu,610021, China
[2] Department of Science and Technology, Chengdu Aeronautic Vocational and Technical College, Chengdu,610021, China
[3] School of Electro-Mechanical Engineering, Guilin University of Electronic Technology, Guilin,541004, China
来源：
Hanjie Xuebao/Transactions of the China Welding Institution | 2015年 / 36卷 / 08期
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D O I：
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中图分类号：
学科分类号：
摘要：
Insertion losses
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页码：9 / 12
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