Analysis of signal integrity of UBM and bump interconnection

被引：0
|
作者：
Liang, Ying [1 ]
Lin, Xunchao [2 ]
Huang, Chunyue [3 ]
Shao, Liangbin [3 ]
Zhang, Xin [1 ]
机构：
[1] Department of Electronic Engineering, Chengdu Aeronautic Vocational and Technical College, Chengdu,610021, China
[2] Department of Science and Technology, Chengdu Aeronautic Vocational and Technical College, Chengdu,610021, China
[3] School of Electro-Mechanical Engineering, Guilin University of Electronic Technology, Guilin,541004, China
来源：
Hanjie Xuebao/Transactions of the China Welding Institution | 2015年 / 36卷 / 08期
关键词：
D O I：
暂无
中图分类号：
学科分类号：
摘要：
Insertion losses
引用
收藏
页码：9 / 12
相关论文
共 50 条
  • [11] Analysis of reflection of signal integrity
    Wang, LX
    Liu, SB
    Xiao, DS
    PROCEEDINGS OF THE THIRD INTERNATIONAL SYMPOSIUM ON INSTRUMENTATION SCIENCE AND TECHNOLOGY, VOL 1, 2004, : 718 - 722
  • [12] Reliability analysis of copper bump interconnection in double-sided power module
    Tsai, Chia-Chi
    Liao, Li-Ling
    Su, Yen-Fu
    Hung, Tuan-Yu
    Chiang, Kuo-Ning
    2015 16TH INTERNATIONAL CONFERENCE ON THERMAL, MECHANICAL AND MULTI-PHYSICS SIMULATION AND EXPERIMENTS IN MICROELECTRONICS AND MICROSYSTEMS (EUROSIME), 2015,
  • [13] Pb-free bumping technology and UBM (Under Bump Metallurgy)
    Jang, SY
    Paik, KW
    Wolf, J
    Reichl, H
    Gloor, H
    ADVANCES IN ELECTRONIC MATERIALS AND PACKAGING 2001, 2001, : 121 - 128
  • [14] Buried bump and AC coupled interconnection technology
    Mick, S
    Luo, L
    Wilson, J
    Franzon, P
    IEEE TRANSACTIONS ON ADVANCED PACKAGING, 2004, 27 (01): : 121 - 125
  • [15] Effect of Under Bump Metallization (UBM) quality on long term reliability
    Rao, Richard
    Seabock, Mike
    Fang, Tong
    Carew, Roy
    ICEPT: 2007 8TH INTERNATIONAL CONFERENCE ON ELECTRONICS PACKAGING TECHNOLOGY, PROCEEDINGS, 2007, : 40 - 46
  • [16] Electromigration failures of UBM/bump systems of flip-chip packages
    Wu, JD
    Zheng, PJ
    Lee, K
    Chiu, CT
    Lee, JJ
    52ND ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, 2002 PROCEEDINGS, 2002, : 452 - 457
  • [17] Effect of under bump metallization (UBM) on interfacial reaction and shear strength of electroplated pure tin solder bump
    Kim, Yu-Na
    Koo, Ja-Myeong
    Park, Sun-Kyu
    Jung, Seung-Boo
    JOURNAL OF THE KOREAN INSTITUTE OF METALS AND MATERIALS, 2008, 46 (01): : 33 - 38
  • [18] Effects of bump height and UBM structure on the reliability performance of 60μm-pitch solder micro bump interconections
    Huang, Yu-Wei
    Zhan, Chau-Jie
    Lin Yu-Min
    Juang, Jing-Ye
    Huang, Shin-Yi
    Chen, Su-Mei
    Fan, Chia-Wen
    Cheng, Ren-Shin
    Chao, Shu-Han
    Lin, C. K.
    Lin, Jie-An
    Chen, Chih
    2014 INTERNATIONAL CONFERENCE ON ELECTRONICS PACKAGING (ICEP), 2014, : 612 - 617
  • [19] A Novel Bump-CPW-bump Structure for Interconnection/Transition of RF MEMS Packaging
    Li, Ning
    Wu, Yuluan
    Chen, Lei
    Wu, Baozhen
    Zhao, Cheng
    Wang, Yi
    Sun, Yue
    2015 16TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY, 2015,
  • [20] Effects of Under Bump Metallurgy (UBM) Materials on the Corrosion of Electroless Nickel Films
    Yu, Jin
    Kim, Kyoungdoc
    METALLURGICAL AND MATERIALS TRANSACTIONS A-PHYSICAL METALLURGY AND MATERIALS SCIENCE, 2015, 46A (07): : 3173 - 3181
12345