A Numerical Analysis of the Enhanced Performance in Heat Transfer of a Manifold Micro-Channel Heat Sink

被引：0
作者：
Tang W. [1 ]
Sun L.-C. [1 ]
Liu H.-T. [1 ]
Xie G. [1 ]
Tang J.-G. [1 ]
Bao J.-J. [1 ]
机构：
[1] State Key Laboratory of Hydraulics and Mountain River Engineering, College of Water Resource&Hydropower, Sichuan University, Chengdu
来源：
Dianzi Keji Daxue Xuebao/Journal of the University of Electronic Science and Technology of China | 2018年 / 47卷 / 06期
关键词：
Chip cooling; Heat dissipation uniformity; Manifold micro-channel heat sink; Micro-channel heat sink;
D O I：
10.3969/j.issn.1001-0548.2018.06.010
中图分类号：
学科分类号：
摘要：
Manifold micro-channel heat sink (MMHS) has a better heat transfer capacity and uniformity compared with the conventional micro-channel heat sink (MHS), showing a great potential in cooling equipments with high heat generation rate like electronic chips. A numerical simulation work was carried out on heat transfer process in a single unit of MHS and MMHS. For the mass flow rate covering 0.57~2.87 kg/h, averaged heat transfer coefficient of the MMHS is enhanced over 100% and the heat dissipation uniformity is increased 52% compared with the MHS. The multiple inlets and outlets in the MMHS contribute a lot to the improvement of heat transfer performance. © 2018, Editorial Board of Journal of the University of Electronic Science and Technology of China. All right reserved.
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页码：864 / 868
页数：4
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