Thermomigration in flip chip solder bump

被引：0

作者：

Wei, Guo-Qiang ^{[1
]}

Shi, Yong-Hua ^{[1
]}

Huang, Yan-Lu ^{[1
]}

Yang, Yong-Qiang ^{[1
]}

Wang, Guo-Rong ^{[1
]}

机构：

[1] School of Mechanical and Automotive Engineering, South China University of Technology, Guangzhou 510640, China

来源：

Cailiao Kexue yu Gongyi/Material Science and Technology | 2009年 / 17卷 / SUPPL. 1期

关键词：

Electronic package - Electronic Packaging - Electronic product - Flip chip solder bump - High current densities - Microstructure evolvement - Solder Bump - Thermomigration;

D O I：

暂无

中图分类号：

学科分类号：

摘要：

引用

页码：128 / 133