In-circuit pin testing: An excellent potential source of value creation

被引:0
|
作者
Holtzer, Mitch
机构
来源
SMT Surface Mount Technology Magazine | 2015年 / 30卷 / 06期
关键词
D O I
暂无
中图分类号
学科分类号
摘要
In-circuit pin testing (ICT) is a common method of inspecting electronic assemblies to measure the effectiveness of the assembly process and to predict electrical functionality. Test probes are put in contact with dedicated test points along the surface of an assembly, checking for electrical functions such as resistance, capacitance inductance and signal timing. The two basic types of ICT are commonly referred to as clamshell and flying probe. The clamshell ICT simultaneously tests dozens of points on a single board. One laboratory type of clamshell ICT device uses three types of pins and four different forces. Flying probe testing is also commonly used for lower value or lower volume assemblies. Flying probes test sequences are determined by easily changeable programming inputs.
引用
收藏
页码:68 / 71
相关论文
共 50 条
  • [41] FUNCTIONAL AND IN-CIRCUIT TESTING TEAM UP TO TACKLE VLSI IN THE 80S
    HANSEN, P
    ELECTRONICS, 1981, 54 (08): : 189 - 195
  • [42] FUNCTIONAL AND IN-CIRCUIT TESTING TEAM UP TO TACKLE VLSI IN THE '80s.
    Hansen, Peter
    Electronics, 1981, 54 (08): : 189 - 195
  • [43] Power Supplies Authoritative Testing. In-circuit and Functional Test in a System.
    Heckmueller, Wilfred
    Elektronik Munchen, 1986, 35 (15): : 105 - 107
  • [44] Entrepreneurship learning as a source of value creation
    Fuentes, Eugenio Sáez
    Hidalgo, Abelardo Castro
    Celulosa Y Papel, 2009, 25 (01): : 11 - 16
  • [45] Knowledge creation - A source of value - Introduction
    von Krogh, G
    Nonaka, I
    Nishiguchi, T
    KNOWLEDGE CREATION: A SOURCE OF VALUE, 2000, : 1 - 9
  • [46] AUTOMATIC QUALITY TESTING OF ASSEMBLED PRINTED-CIRCUITS USING AN IN-CIRCUIT TEST UNIT
    GRAFF, A
    F&M-FEINWERKTECHNIK & MESSTECHNIK, 1985, 93 (07): : 389 - 391
  • [47] Non-destructive in-circuit testing device for dielectric substrates without dimensional measurement
    Cheng, Jin
    Gao, Chong
    Cui, Hongling
    Li, En
    Zhang, Yunpeng
    Li, Canping
    2022 INTERNATIONAL CONFERENCE ON MICROWAVE AND MILLIMETER WAVE TECHNOLOGY (ICMMT), 2022,
  • [48] Problem with no-clean flux spattering on in-circuit testing pads diagnosed by EDS analysis
    Dusek, K.
    Busek, D.
    MICROELECTRONICS RELIABILITY, 2016, 56 : 162 - 169
  • [49] TEST PATTERN GENERATION METHODOLOGY FOR LSI/VLSI MODULE LEVEL TESTING AND IN-CIRCUIT CARD LEVEL TESTING.
    Dinwiddie, J.M.
    Viele, A.A.
    IBM technical disclosure bulletin, 1984, 26 (11): : 5909 - 5910
  • [50] In-circuit testing of complex circuits using on-wafer probing and electromagnetic coupled ground interconnects
    Kassner, J.
    Menzel, W.
    IEEE MTT-S International Microwave Symposium Digest, 2000, 3 : 1863 - 1866