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Kumagai K., Yang C., Goto S., Ikenaga T., Mabuchi Y., Yoshida K., System-in-silicon architecture and its application to an H.264/AVC motion estimation fort 1080HDTV, Proc. International Solid-State Circuits Conference (ISSCC'06), pp. 430-431, (2006)
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Davis W.R., Wilson J., Mick S., Xu J., Hua H., Mineo C., Sule A.M., Steer M., Franzon P.D., Demystifying 3D ICs: The pros and cons of going vertical, IEEE Design and Test of Computers, 22, 6, pp. 498-510, (2005)
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Kanda K., Antono D.D., Ishida K., Kawaguchi H., Kuroda T., Sakurai T., 1.27-Gbps/pin, 3mW/pin wireless superconnect (WSC) interface scheme, Proc. International Solid-State Circuits Conference (ISSCC'03), pp. 186-187, (2003)
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Miura N., Ishikuro H., Sakurai T., Kuroda T., A 0.14pJ/b inductive-coupling inter-chip data transceiver with digitally- controlled precise pulse shaping, Proc. International Solid-State Circuits Conference (ISSCC'07), pp. 358-359, (2007)
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Miura N., Mizoguchi D., Inoue M., Niitsu K., Nakagawa Y., Tago M., Fukaishi M., Sakurai T., Kuroda T., A 1Tb/s 3W inductive-coupling transceiver for inter-chip clock and data link, Proc. International Solid-State Circuits Conference (ISSCC'06), pp. 424-425, (2006)
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Burns J., McIlrath L., Keast C., Lewis C., Loomis A., Warner K., Wyatt P., Three-dimensional integrated circuits for low-power high-bandwidth systems on a chip, Proc. International Solid-State Circuits Conference (ISSCC'01), pp. 268-269, (2001)
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Matsutani H., Bogdan P., Marculescu R., Take Y., Sasaki D., Zhang H., Koibuchi M., Kuroda T., Amano H., A case for wireless 3d NoCs for CMPs, Proc. 18th Asia and South Pacific Design Automation Conference (ASP-DAC'13), (2013)
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Matsutani H., Take Y., Sasaki D., Kimura M., Ono Y., Nishiyama Y., Koibuchi M., Kuroda T., Amano H., A vertical bubble flow network using inductive-coupling for 3-D CMPs, Proc. International Symposium on Networks-on-Chip (NOCS'11), pp. 49-56, (2011)
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Koizumi Y., Amano H., Matsutani H., Miura N., Kuroda T., Sakamoto R., Namiki M., Usami K., Kondo M., Nakamura H., CMA-Cube: A scalable reconfigurable accelerator with 3-D wireless inductive coupling interconnect, The Demo Session at the 11th IEEE International Conference on Field Programmable Technology (ICFPT'12), (2012)