Post-Buckling Analysis for Addressing Asymmetric Warping of Fan-Out Reconstitution Process

被引：0

作者：

Chen, Chia-Yu ^{[1
]}

Lee, Yu-Ching ^{[1
]}

Chen, Kuo-Shen ^{[1
]}

Chen, Dao-Long ^{[2
]}

Lin, Yu-Xuan ^{[2
]}

Lai, Wei-Hong ^{[2
]}

Yang, Hung-Chun ^{[1
,2
]}

Chen, Tang-Yuan ^{[2
]}

Ho, Ching-Jenq ^{[1
]}

Kao, Chin-Li ^{[2
]}

机构：

[1] National Cheng-Kung University, Mechanical Engineering Department, Tainan,70101, Taiwan

[2] Advanced Semiconductor Engineering Inc. Group Corporate R&D, Kaohsiung,81174, Taiwan

来源：

2023 International Conference on Electronics Packaging, ICEP 2023 | 2023年

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D O I：

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摘要：

Chip scale packages - Finite element method - Nonlinear analysis - Three dimensional integrated circuits

引用

页码：265 / 266