Material Removal Behavior in Ultrasonic Assisted Grinding of SiC Ceramics

被引：5

作者：

Cao J. ^{[1
,2
]}

Zhang Q. ^{[1
,2
]}

机构：

[1] School of Mechanical, Electronic and Control Engineering, Beijing Jiaotong University, Beijing

[2] Key Laboratory of Vehicle Advanced Manufacturing, Measuring and Control Technology, Ministry of Education, Beijing Jiaotong University, Beijing

来源：

Jixie Gongcheng Xuebao/Journal of Mechanical Engineering | 2019年 / 55卷 / 13期

关键词：

Grinding; Material removal; SiC ceramics; Ultrasonic vibration;

D O I：

10.3901/JME.2019.13.205

中图分类号：

学科分类号：

摘要：

In order to investigate the material removal behavior in ultrasonic assisted grinding of SiC ceramics, simulation of the ultrasonic-assisted scratching using the smooth particle hydrodynamics (SPH) are operated. Meanwhile, the ultrasonic-assisted scratching tests are operated on the constructed ultrasonic assisted scratching (UAS) unit for comparison. The results show that there are two scratching modes in the UAS process: An intermittent mode and a continuous mode. The critical depth of cut in UAS is deeper than that in conventional scratching and ultrasonic assisted internal grinding of SiC ceramics. This study confirmed that ultrasonic assisted grinding can easily achieve the ductile grinding. © 2019 Journal of Mechanical Engineering.

引用

页码：205 / 211

页数：6

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