Building next-gen interconnect solutions

Designing next-generation interfaces is all about transmitting more data at higher speeds. The growing need for bandwidth is creating new applications where chips and connectors must offer major speed improvements while maintaining acceptable performance characteristics and managing higher system operating temperatures. The need for speed is leading the evolution in system design including expanded use of PAM4 modulation, maintaining signal integrity at high speeds, and developing connectors with features and capabilities tailored to high-speed operations.