Fatigue life estimation of components mounted on PCB due to vibration

被引：0

作者：

Mishra D. ^{[1
]}

Trikha M. ^{[2
]}

Kamesh D. ^{[2
]}

Venkatesh K. ^{[2
]}

Ravindra M. ^{[2
]}

机构：

[1] Liquid Propulsion Systems Center, HAL 2nd Stage HPO, Bangalore, 560008, Karnataka

[2] ISRO Satellite Centre, Vimanapura Post, Bangalore, 560017, Karnataka

来源：

Trikha, Manish (mtrikha1@yahoo.com) | 2018年 / Springer Heidelberg卷 / 00期

关键词：

Component stress; Fatigue life; Printed circuit board (PCB); Spacecraft; Vibration analysis;

D O I：

10.1007/978-981-10-6002-1_29

中图分类号：

学科分类号：

摘要：

A spacecraft consists of a number of electronic packages to meet the functional requirements. An electronic package is generally an assembly of printed circuit boards placed in a mechanical housing. A number of electronic components are mounted on the printed circuit board (PCB). A spacecraft experiences various types of loads during its launch such as vibration, acoustic and shock loads. Prediction of response for printed circuit boards due to vibration loads is important for mechanical design and reliability of electronic packages. Dynamic analysis of printed circuit boards is carried out using finite element method. The components mounted on PCB experience stresses due to curvature of the board and inertia loads. The response of the component depends on its natural frequency as well as PCB dynamic characteristics. The objective of this paper is to predict the fatigue life of components mounted on printed circuit boards due to vibration. A case study of a typical component mounted on PCB is taken up and dynamic analysis is carried out for base excitation. Modal analysis and frequency response analysis are carried out using FEM. The component lead stresses due to vibration are determined. The fatigue life is estimated for sine and random vibration environment. © 2018, Springer Nature Singapore Pte Ltd.

引用

页码：369 / 379

页数：10

共 9 条

[1] Steinberg D.S., Vibration Analysis for Electronic Equipment, 3Rd Edn, (2000)
[2] Suhir E., Predicted fundamental vibration frequency of a heavy electronic component mounted on a printed circuit board, J Electron Packag, 122, 1, pp. 3-5, (2000)
[3] Schaller A., Finite Element Analysis of Microelectronic Component-State of the Art, (1988)
[4] Silva G.H.C., Goncalves P.J.P., A model for computing vibration induced stresses of electronic components in a general flexible mounting, J Sound Vib, 332, pp. 5192-5206, (2013)
[5] Jung I.H., Park T.W., Han S.W., Seo J.H., Kim S.H., Structural vibration analysis of electronic equipment for satellite under launch environment, J Korean Soc Precis Eng, 21, 8, pp. 1440-1445, (2004)
[6] Pitarresi J.M., Modeling of printed circuit cards subject to vibration, Department of Mechanical and Industrial Engineering, State University of New York at Binghamton, Binghamton, New York, 13901, pp. 2104-2107, (1990)
[7] Liguore S., Followell D., Vibration fatigue of surface mount technology (SMT) solder joints, Proceedings Annual Reliability and Maintainability Symposium, pp. 18-26, (1995)
[8] Dehbi A., Ousten Y., Danto Y., Wondrak W., Vibration lifetime modelling of PCB assemblies using steinberg model, Microelectron Reliab, 45, pp. 1658-1661, (2005)
[9] Chen Y.S., Wang C.S., Yang Y.J., Combining vibration test with finite element analysis for the fatigue life estimation of PBGA components, Microelectron Reliab, 48, pp. 638-644, (2008)

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