Performance analysis for D-3 material using response surface methodology on WEDM

被引：0

作者：

Khanna, Rajesh ^{[1
]}

Singh, Hari ^{[2
]}

机构：

[1] Mechanical Engineering Department, M.M. University, Mullana, 133207, Ambala, Haryana

[2] Mechanical Engineering Department, National Institute of Technology, Kurukshetra, 136119, Haryana

来源：

International Journal of Machining and Machinability of Materials | 2013年 / 14卷 / 01期

关键词：

CCD; central composite design; cryogenic treatment; D-3; material; desirability; die manufacturing; electrical discharge machining; electro-discharge machining; metal removal rate; MRR; multiobjective optimisation; performance evaluation; response surface methodology; surface quality; surface roughness; wear resistance; WEDM; wire EDM;

D O I：

10.1504/IJMMM.2013.055120

中图分类号：

学科分类号：

摘要：

The present paper identifies process parameters that affect metal removal rate and surface roughness in machining of cryogenic treated D-3 material on wire-cut electric discharge machine tool. Central composite design is used to plan and conduct the experiments. The regression is employed to develop empirical relationships between different process parameters and output responses, and subsequently to analyse and yield the optimal values of process parameters. As the effect of process parameters on metal removal rate and surface roughness is contrary, the problem is formulated as a multi objective optimisation problem and solved using weight method. Effort is made to find the machine settings to obtain maximum metal removal rate and minimum surface roughness. Confirmation experiments are also carried out which reflect that the developed mathematical models are appropriate for the effective machining of D-3 material. The optimal combination of WEDM process parameters obtained from the study satisfies the real requirement of quality machining of D-3 material in practice. In this research paper, cryogenic treatment of work piece is carried out before machining for improving the wear resistance of the material which is necessary for die manufacturing. Copyright © 2013 Inderscience Enterprises Ltd.

引用

页码：45 / 65

页数：20

共 20 条

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