High-aspect-ratio copper via filling used for three-dimensional chip stacking

被引：0

作者：

Sun, Jian-Jun ^{[1
]}

Kondo, Kazuo ^{[1
]}

Okamura, Takuji ^{[1
]}

Oh, SeungJin ^{[1
]}

Tomisaka, Manabu ^{[2
]}

Yonemura, Hitoshi ^{[2
]}

Hoshino, Masataka ^{[2
]}

Takahashi, Kenji ^{[2
]}

机构：

[1] Department of Applied Chemistry, Okayama University, Okayama 700-0082, Japan

[2] Tsukuba Research Center, ESITRD, Tsukuba Center, Incorporated, Tsukuba, Ibaraki 305-0047, Japan

来源：

J Electrochem Soc | / 6卷 / G355-G358期

关键词：

Compendex;

D O I：

暂无

中图分类号：

学科分类号：

摘要：

Aspect ratio - Cyclic voltammetry - Electric currents - Electrodeposition - Electrodes - Electronics packaging - LSI circuits - Plating - Scanning electron microscopy

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