Integrated RF-MEMS technology for reconfigurable RF transceivers

被引：0
|
作者：
Kuwabara, Kei [1 ]
Sato, Norio [2 ]
Shimamura, Toshishige [2 ]
Morimura, Hiroki [2 ]
Kodate, Junichi [3 ]
Ishii, Hiromu [2 ]
机构：
[1] NTT Microsystem Integration Laboratories, Atsugi-shi, 243-0198, Japan
[2] Smart Devices Laboratory, NTT Microsystem Integration Laboratories
[3] MEMS Devices Research Group, Smart Devices Laboratory, NTT Microsystem Integration Laboratories
来源：
NTT Technical Review | 2007年 / 5卷 / 10期
关键词：
Electromechanical devices - MEMS - Space optics;
D O I：
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学科分类号：
摘要：
This paper describes a novel structure and fabrication process for integrated RF-MEMS (radio frequency microelectromechanical systems) technology. This technology features a multilayer structure and an encapsulation process for the integration and protection of RF MEMS devices. Various types of encapsulated RF-MEMS devices, such as switches and varactors, were fabricated on the same substrate simultaneously. Experimental results indicate that this technology is promising for the development of small low-power reconfigurable RF transceivers.
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