Effects of small amount addition of rare earth Y on microstructure and property of Sn3.0Ag0.5Cu solder

被引：1
作者：
Li, Hui [1 ]
机构：
[1] School of Mechanical and Electrical Engineering, Changzhou Institute of Technology, Jiangsu
来源：
Key Engineering Materials | 2014年 / 584卷
关键词：
Lead-free solder; Mechanical property; Microstructure; Rare earth; SnAgCu;
D O I：
10.4028/www.scientific.net/KEM.584.3
中图分类号：
学科分类号：
摘要：
In the present work, effect of adding small amount of Y on the microstructure, physical and mechanical properties of Sn3.0Ag0.5Cu solder has been investigated. The purpose is to understand if the heavy rare earth Y has similar effect as light rare earth Ce or La on improving properties of SnAgCu lead-free solder. The results indicated that adding small amount of Y can evidently improve the wettability, mechanical strength and creep rupture life of the Sn3.0Ag0.5Cu solder alloy. It is pointed out that proper Y content in the Sn3.0Ag0.5Cu solder alloy should be in a range of 0.05~0.25wt%. Moreover, It is felt that the increase in mechanical strength may be related to the refining of IMCs of the solder due to the addition of small amount of Y. Copyright © 2014 Trans Tech Publications, Switzerland.
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页码：3 / 8
页数：5
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