Effects of small amount addition of rare earth Y on microstructure and property of Sn3.0Ag0.5Cu solder

被引：1

作者：

Li, Hui ^{[1
]}

机构：

[1] School of Mechanical and Electrical Engineering, Changzhou Institute of Technology, Jiangsu

来源：

Key Engineering Materials | 2014年 / 584卷

关键词：

Lead-free solder; Mechanical property; Microstructure; Rare earth; SnAgCu;

D O I：

10.4028/www.scientific.net/KEM.584.3

中图分类号：

学科分类号：

摘要：

In the present work, effect of adding small amount of Y on the microstructure, physical and mechanical properties of Sn3.0Ag0.5Cu solder has been investigated. The purpose is to understand if the heavy rare earth Y has similar effect as light rare earth Ce or La on improving properties of SnAgCu lead-free solder. The results indicated that adding small amount of Y can evidently improve the wettability, mechanical strength and creep rupture life of the Sn3.0Ag0.5Cu solder alloy. It is pointed out that proper Y content in the Sn3.0Ag0.5Cu solder alloy should be in a range of 0.05~0.25wt%. Moreover, It is felt that the increase in mechanical strength may be related to the refining of IMCs of the solder due to the addition of small amount of Y. Copyright © 2014 Trans Tech Publications, Switzerland.

引用

页码：3 / 8

页数：5

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