Ni alloy laminated high strength Bi-2223 wire

被引：0
|
作者：
Osabe, Goro [1 ]
Yamazaki, Kohei [1 ]
Nakashima, Takayoshi [1 ]
Kadoya, Takuro [1 ]
Kobayashi, Shinichi [1 ]
Kato, Takeshi [1 ]
机构：
[1] Superconductivity Technology Division, Japan
来源：
SEI Technical Review | 2017年 / 84期
关键词：
D O I：
暂无
中图分类号：
学科分类号：
摘要：
Sumitomo Electric Industries, Ltd. has developed and commercialized a high-strength DI-BSCCO Type HT-NX wire. This wire is reinforced with Ni alloy tapes and undergoes residual axial compression after lamination. The wire has a critical tensile stress of 400 MPa at 77K. The new wire structure successfully reduced the splice resistance without sacrificing the mechanical properties. This wire is highly useful for nuclear magnetic resonance and other high field magnetic applications.
引用
收藏
页码：15 / 21
相关论文
共 50 条
  • [1] Hoop stress test on new high strength alloy laminated Bi-2223 conductor
    Miyoshi, Y.
    Nishijima, G.
    Kitaguchi, H.
    Chaud, X.
    SUPERCONDUCTOR SCIENCE & TECHNOLOGY, 2015, 28 (07):
  • [2] Development of High Strength Ag-Sheath Bi-2223 Wire
    Osabe, Goro
    JOURNAL OF THE JAPAN INSTITUTE OF METALS AND MATERIALS, 2016, 80 (07) : 396 - 405
  • [3] Development of Ag alloy sheathed Bi-2223 round wire
    Hikichi, Y
    Nishioka, J
    Koizumi, T
    Hasegawa, T
    Nagaya, S
    ADVANCES IN SUPERCONDUCTIVITY XII, 2000, : 667 - 669
  • [4] Preparation of Bi-2223 bulk composed with silver-alloy wire
    Hirano, S
    Wakasa, Y
    Saka, A
    Yoshizawa, S
    Oya-Seimiya, Y
    Hishinuma, Y
    Nishimura, A
    Matsumoto, A
    Kumakura, H
    PHYSICA C-SUPERCONDUCTIVITY AND ITS APPLICATIONS, 2003, 392 : 458 - 462
  • [5] Formation and growth of Bi-2223 phase in Bi-2223/Ag and Bi-2223/AgAu tapes
    Xiaobo Ma
    Shengnan Zhang
    Jianqing Feng
    Chengshan Li
    Botao Shao
    Jianfeng Li
    Journal of Materials Science: Materials in Electronics, 2023, 34
  • [6] Formation and growth of Bi-2223 phase in Bi-2223/Ag and Bi-2223/AgAu tapes
    Ma, Xiaobo
    Zhang, Shengnan
    Feng, Jianqing
    Li, Chengshan
    Shao, Botao
    Li, Jianfeng
    JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2023, 34 (04)
  • [7] Thermal Conductivity and Dilatation of Bi-2223/Ag (DI-BSCCO) Superconducting Wire Laminated With Various Thin Alloy Tapes
    Naito, Tomoyuki
    Fujishiro, Hiroyuki
    Yamada, Yuichi
    IEEE TRANSACTIONS ON APPLIED SUPERCONDUCTIVITY, 2018, 28 (04)
  • [8] Designing and Manufacture of HTSc Flexible Wire of Bi-2223
    Emad K. Al-Shakerchi
    Mohammed T. Abdul-Nabi
    Omar Adnaan
    Journal of Superconductivity and Novel Magnetism, 2010, 23 : 1251 - 1259
  • [9] Bi-2223 precursor billets for PIT wire production
    Yamashita, T
    Alarco, JA
    Ilyushechkin, AJ
    Tomlins, K
    Talbot, P
    IEEE TRANSACTIONS ON APPLIED SUPERCONDUCTIVITY, 1999, 9 (02) : 2581 - 2584
  • [10] Designing and Manufacture of HTSc Flexible Wire of Bi-2223
    Al-Shakerchi, Emad K.
    Abdul-Nabi, Mohammed T.
    Adnaan, Omar
    JOURNAL OF SUPERCONDUCTIVITY AND NOVEL MAGNETISM, 2010, 23 (07) : 1251 - 1259
12345