Printable stretchable interconnects

被引：111
作者：
Dang W. [1 ,2 ]
Vinciguerra V. [3 ]
Lorenzelli L. [2 ]
Dahiya R. [1 ]
机构：
[1] Bendable Electronics and Sensing Technologies Group, School of Engineering, University of Glasgow
[2] Microsystem Technology Research Unit, CMM, Fondazione Bruno Kessler, Trento
[3] ST Microelectronics, Catania
来源：
Flexible and Printed Electronics | 2017年 / 2卷 / 01期
基金：
英国工程与自然科学研究理事会;
关键词：
Interconnects; Nanocomposites; Printed sensors; Stretchable electronics; Stretchable interconnects;
D O I：
10.1088/2058-8585/aa5ab2
中图分类号：
学科分类号：
摘要：
This article presents recent progress and a comprehensive overview of stretchable interconnects based on printable nanocomposites. Nanocomposite-based inks for printed stretchable interconnects have been categorized according to dispersed filler materials. They comprise of carbon-based fillers and metal-based fillers. Benefits in terms of excellent electrical performance and elastic properties make nanocomposites the ideal candidates for stretchable interconnect applications. Deeper analysis of nanocomposites-based stretchable interconnects includes the correlation between the size of fillers, percolation ratio, maximum electrical conductivity and mechanical elasticity. The key trends in the field have been highlighted using curve fitting methods on large data collected from the literature. Furthermore, a wide variety of applications for stretchable interconnects are presented.
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