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Investigation and modeling of binder removal process in nano/micro bimodal powder injection molding
被引：0
作者：
机构：
[1] Oh, Joo Won
[2] Lee, Won Sik
[3] Park, Seong Jin
来源：
Park, Seong Jin (sjpark87@postech.ac.kr)
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1600年
/
Springer London卷
/
97期
关键词：
Number:;
-;
Acronym:;
MSIP;
Sponsor: Ministry of Science;
ICT and Future Planning;
2011-0030075;
NRF;
Sponsor: National Research Foundation of Korea;
Sponsor: Ministry of Science ICT and Future Planning;
B551179-12-02-00;
NST;
Sponsor: National Research Council of Science and Technology;
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页码：9 / 12
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